Dr. Xxxxxx is currently the Principal Consultant at Xxxxxx Xxxxxxxxxx and has over 27 years of experience in semiconductor packaging. Xxxxxxx specializes in 2.5D/3D packaging layout and integration for AI Semiconductor Start-Ups. Xxxxxxx focuses on helping these companies achieve successful production from the first pass by optimizing packaging performance, reducing costs, and accelerating time-to-market. Xxxxxxx has a proven track record of developing practical, sustainable solutions for leading chip industry manufacturers. Xxxxxxx has developed practical and sustainable solutions that tackle packaging challenges, identify new opportunities, and implement effective risk management strategies. Dr. Xxxxxx holds a Master of Science and Doctor of Philosophy in Ceramic Engineering from the Xxxxxxxxxx xx Xxxxxxxx xx Xxxxxx Xxxxxxxxx.
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